0015800209 datasheet

0015800209 - 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating

Название/Part No:

0015800209

Описание/Description:

2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating

Производитель/Maker:

Molex Electronics Ltd. (MOLEX)

Ссылка на datasheet:

~/0015800209.pdf

0015800209 и другие

Компонент	Описание	Производитель	PDF
0015800201	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.
0015800203	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38lm (15l) Gold (Au) Selective Plating	Molex Electronics Ltd.
0015800205	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76lm (30l) Gold (Au) Selective Plating	Molex Electronics Ltd.
0015800207	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.
0015800209	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating	Molex Electronics Ltd.

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