M541 datasheet - Bonding, Handling, and Mounting Procedures for Chip Diode Devices | M541.pdf by M/A-COM Technology Solutions, Inc. | M541 documentation view on EHAM.RU

M541 - Bonding, Handling, and Mounting Procedures for Chip Diode Devices

M541 datasheet - Bonding, Handling, and Mounting Procedures for Chip Diode Devices

Название/Part No:

M541

Описание/Description:

Bonding, Handling, and Mounting Procedures for Chip Diode Devices

Производитель/Maker:

M/A-COM Technology Solutions, Inc. (MACOM)

Ссылка на datasheet:

M541 и другие

Компонент	Описание	Производитель	PDF
501-4.0M-540A	HCMOS / TTL / Clipped Sine	Oscilent Corporation
501-4.0M-540B	HCMOS / TTL / Clipped Sine	Oscilent Corporation
501-4.0M-540C	HCMOS / TTL / Clipped Sine	Oscilent Corporation
502-4.0M-540A	HCMOS / TTL / Clipped Sine	Oscilent Corporation
502-4.0M-540B	HCMOS / TTL / Clipped Sine	Oscilent Corporation
502-4.0M-540C	HCMOS / TTL / Clipped Sine	Oscilent Corporation
503-4.0M-540A	HCMOS / TTL / Clipped Sine	Oscilent Corporation
503-4.0M-540B	HCMOS / TTL / Clipped Sine	Oscilent Corporation
503-4.0M-540C	HCMOS / TTL / Clipped Sine	Oscilent Corporation
504-4.0M-540A	HCMOS / TTL / Clipped Sine	Oscilent Corporation