H8/327 datasheet - In-Circuit Emulator for Renesas H8/300 and H8/500 | H8/327.pdf by List of Unclassifed Manufacturers | H8/327 documentation view on EHAM.RU

H8/327 - In-Circuit Emulator for Renesas H8/300 and H8/500

H8/327 datasheet - In-Circuit Emulator for Renesas H8/300 and H8/500

Название/Part No:

H8/327

Описание/Description:

In-Circuit Emulator for Renesas H8/300 and H8/500

Производитель/Maker:

List of Unclassifed Manufacturers (ETC)

Ссылка на datasheet:

H8/327 и другие

Компонент	Описание	Производитель	PDF
0010883201	2.54mm (.100") Pitch C-Grid^ Breakaway Header, High Profile, Dual Row, Right Angle,20 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating	Molex Electronics Ltd.
0010883221	2.54mm (.100") Pitch C-Grid^ Breakaway Header, High Profile, Dual Row, Right Angle, 22 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating	Molex Electronics Ltd.
0010883241	2.54mm (.100") Pitch C-Grid^ Breakaway Header, High Profile, Dual Row, Right Angle, 24 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating	Molex Electronics Ltd.
0010883261	2.54mm (.100") Pitch C-Grid^ Breakaway Header, High Profile, Dual Row, Right Angle, 26 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating	Molex Electronics Ltd.
0010883281	2.54mm (.100") Pitch C-Grid^ Breakaway Header, High Profile, Dual Row, Right Angle, 28 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating	Molex Electronics Ltd.
0011-18-4832	Insulation Punch	Molex Electronics Ltd.
001118-4832	Insulation Punch	Molex Electronics Ltd.
0011184832	Insulation Punch	Molex Electronics Ltd.
0015445832	2.54mm (.100") Pitch C-Grid^ Receptacle, Through Hole, Dual Row, High Profile,Vertical, High-Temperature, 32 Circuits	Molex Electronics Ltd.
0015446832	2.54mm (.100") Pitch C-Grid^ Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 32 Circuits	Molex Electronics Ltd.